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DATA SHEET
MOS INTEGRATED CIRCUIT
PD448012-X
8M-BIT CMOS STATIC RAM 512K-WORD BY 16-BIT EXTENDED TEMPERATURE OPERATION
Description
The PD448012-X is a high speed, low power, 8,388,608 bits (524,288 words by 16 bits) CMOS static RAM. The PD448012-X has two chip enable pins (/CE1, CE2) to extend the capacity. The PD448012-X is packed in 48-pin PLASTIC TSOP (I) (Normal bent).
Features
* 524,288 words by 16 bits organization * Fast access time: 55, 70, 85, 100, 120 ns (MAX.) * Byte data control: /LB (I/O1 - I/O8), /UB (I/O9 - I/O16) * Low voltage operation (B version: VCC = 2.7 to 3.6 V, C version: VCC = 2.2 to 3.6 V) * Low VCC data retention : 1.0 V (MIN.) * Operating ambient temperature: TA = -25 to +85C * Output Enable input for easy application * Two Chip Enable inputs: /CE1, CE2
Part number
Access time ns (MAX.)
Operating supply Operating ambient voltage V temperature C -25 to +85 At operating mA (MAX.) 45
Note
Supply current At standby At data retention
A (MAX.)
15
A (MAX.)
6
PD448012-BxxX PD448012-CxxX
55, 70, 85, 100 70, 85, 100, 120
2.7 to 3.6 2.2 to 3.6
45
Note Cycle time 70 ns, PD448012-B55X : 50 mA
The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for availability and additional information.
Document No. M14466EJ5V0DS00 (5th edition) Date Published July 2001 NS CP (K) Printed in Japan
The mark 5 shows major revised points.
(c)
1999
PD448012-X
Ordering Information
Part number Package Access time ns (MAX.) Operating supply voltage V Operating temperature C -25 to +85 B version Remark
PD448012GY-B55X-MJH PD448012GY-B70X-MJH PD448012GY-B85X-MJH PD448012GY-B10X-MJH PD448012GY-C70X-MJH PD448012GY-C85X-MJH PD448012GY-C10X-MJH PD448012GY-C12X-MJH
48-pin PLASTIC TSOP (I) (12x18) (Normal bent)
55 70 85 100 70 85 100 120
2.7 to 3.6
2.2 to 3.6
C version
2
Data Sheet M14466EJ5V0DS
PD448012-X
Pin Configuration (Marking Side)
/xxx indicates active low signal.
48-pin PLASTIC TSOP (I) (12x18) (Normal bent) [ PD448012GY-BxxX-MJH ] [ PD448012GY-CxxX-MJH ]
A15 A14 A13 A12 A11 A10 A9 A8 NC NC /WE CE2 NC /UB /LB A18 A17 A7 A6 A5 A4 A3 A2 A1
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24
48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25
A16 NC GND I/O16 I/O8 I/O15 I/O7 I/O14 I/O6 I/O13 I/O5 VCC I/O12 I/O4 I/O11 I/O3 I/O10 I/O2 I/O9 I/O1 /OE GND /CE1 A0
A0 - A18
: Address inputs
I/O1 - I/O16 : Data inputs / outputs /CE1, CE2 /WE /OE /LB, /UB VCC GND NC : Chip Enable 1, 2 : Write Enable : Output Enable : Byte data select : Power supply : Ground : No Connection
Remark
Refer to Package Drawing for the 1-pin index mark.
Data Sheet M14466EJ5V0DS
3
PD448012-X
Block Diagram
VCC GND A0 A18
Address buffer
Row decoder
Memory cell array 8,388,608 bits
I/O1 - I/O8 I/O9 - I/O16 Input data controller
Sense amplifier / Switching circuit Column decoder
Output data controller
Address buffer
/CE1 CE2
/LB /UB /WE
/OE
Truth Table
/CE1 CE2 /OE /WE /LB /UB Mode I/O1 - I/O8 H x L x L H x x H L x x H H x x x L L H x L L L H x x x x H x x x L H L L H L H Output disable Word read Lower byte read Upper byte read Word write Lower byte write Upper byte write Not selected High impedance DOUT DOUT High impedance DIN DIN High impedance High impedance High impedance DOUT High impedance DOUT DIN High impedance DIN High impedance ISB ICCA Not selected High impedance I/O I/O9 - I/O16 High impedance ISB Supply current
Remark x : VIH or VIL 4
Data Sheet M14466EJ5V0DS
PD448012-X
Electrical Specifications
Absolute Maximum Ratings
Parameter Supply voltage Input / Output voltage Operating ambient temperature Storage temperature Symbol VCC VT TA Tstg -0.5
Note
Condition -0.5
Rating
Note
Unit V V C C
to +4.0
to VCC + 0.4 (4.0 V MAX.) -25 to +85 -55 to +125
Note -3.0 V (MIN.) (Pulse width : 30 ns)
Caution Exposing the device to stress above those listed in Absolute Maximum Rating could cause permanent damage. The device is not meant to be operated under conditions outside the limits described in the operational section of this specification. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability.
Recommended Operating Conditions
Parameter Symbol Condition
PD448012-BxxX
MIN. MAX. 3.6 VCC + 0.4 -
Note
PD448012-CxxX
MIN. 2.2 2.4 2.0 -0.3
Note
Unit
MAX. 3.6 VCC + 0.4 VCC + 0.3 +0.3 +85 V C V V
Supply voltage High level input voltage
VCC VIH 2.7 V VCC 3.6 V 2.2 V VCC < 2.7 V
2.7 2.4 - -0.3
Low level input voltage Operating ambient temperature
VIL TA
+0.5 +85
-25
-25
Note -1.5 V (MIN.) (Pulse width: 30 ns) Capacitance (TA = 25C, f = 1 MHz)
Parameter Input capacitance Input / Output capacitance Symbol CIN CI/O Test condition VIN = 0 V VI/O = 0 V MIN. TYP. MAX. 8 10 Unit pF pF
Remarks 1. VIN : Input voltage, VI/O : Input / Output voltage 2. These parameters are not 100% tested.
Data Sheet M14466EJ5V0DS
5
PD448012-X
DC Characteristics (Recommended Operating Conditions Unless Otherwise Noted) (1/2)
Parameter Symbol Test condition VCC 2.7 V Unit
PD448012-BxxX
MIN. Input leakage current I/O leakage current ILI ILO VIN = 0 V to VCC VI/O = 0 V to VCC, /CE1 = VIH or CE2 = VIL or /WE = VIL or /OE = VIH Operating supply current ICCA1 /CE1 = VIL, CE2 = VIH, Minimum cycle time, II/O = 0 mA ICCA2 /CE1 = VIL, CE2 = VIH, II/O = 0 mA, Cycle time = ICCA3 - 4 Cycle time = 55 ns Cycle time 70 ns - - 50 45 mA -1.0 -1.0 TYP. MAX. +1.0 +1.0
A A
- 6
/CE1 0.2 V, CE2 VCC - 0.2 V, Cycle time = 1 s, II/O = 0 mA, VIL 0.2 V, VIH VCC - 0.2 V
Standby supply current
ISB ISB1 ISB2 ISB3
/CE1 = VIH or CE2 = VIL or /LB = /UB = VIH /CE1 VCC - 0.2 V, CE2 VCC - 0.2 V CE2 0.2 V /LB = /UB VCC - 0.2 V, /CE1 0.2 V, CE2 VCC - 0.2 V
- 1.0 1.0 1.0
0.6 15 15 15
mA
A
High level output voltage Low level output voltage
VOH VOL
IOH = -0.5 mA IOL = 1.0 mA
2.4 0.4
V V
Remarks 1. VIN : Input voltage, VI/O : Input / Output voltage 2. These DC characteristics are in common regardless of product classification.
6
Data Sheet M14466EJ5V0DS
PD448012-X
DC Characteristics (Recommended Operating Conditions Unless Otherwise Noted) (2/2)
Parameter Symbol Test condition VCC 2.2 V Unit
PD448012-CxxX
MIN. Input leakage current I/O leakage current ILI ILO VIN = 0 V to VCC VI/O = 0 V to VCC, /CE1 = VIH or CE2 = VIL or /WE = VIL or /OE = VIH Operating supply current ICCA1 /CE1 = VIL, CE2 = VIH, Minimum cycle time, II/O = 0 mA ICCA2 VCC 2.7 V - - - - - 45 30 4 2 6 mA -1.0 -1.0 TYP. MAX. +1.0 +1.0
A A
/CE1 = VIL, CE2 = VIH, II/O = 0 mA, Cycle time =
VCC 2.7 V
ICCA3
/CE1 0.2 V, CE2 VCC - 0.2 V, Cycle time = 1 s, II/O = 0 mA, VIL 0.2 V, VIH VCC - 0.2 V VCC 2.7 V
- -
5 0.6 0.6 15 13 15 13 15 13 V mA
Standby supply current
ISB
/CE1 = VIH or CE2 = VIL or /LB = /UB = VIH VCC 2.7 V
- 1.0
ISB1
/CE1 VCC - 0.2 V, CE2 VCC - 0.2 V VCC 2.7 V
A
0.9 1.0
ISB2
CE2 0.2 V VCC 2.7 V
0.9 1.0 0.9 2.4
ISB3
/LB = /UB VCC - 0.2 V, /CE1 0.2 V, CE2 VCC - 0.2 V VCC 2.7 V
High level output voltage
VOH
IOH = -0.5 mA VCC 2.7 V
1.8 0.4 V
Low level output voltage
VOL
IOL = 1.0 mA
Remarks 1. VIN : Input voltage, VI/O : Input / Output voltage 2. These DC characteristics are in common regardless of product classification.
Data Sheet M14466EJ5V0DS
7
PD448012-X
AC Characteristics (Recommended Operating Conditions Unless Otherwise Noted)
AC Test Conditions [ PD448012-B55X, PD448012-B70X, PD448012-B85X, PD448012-B10X ] Input Waveform (Rise and Fall Time 5 ns)
0.9 VCC VCC/2 0.1 VCC Test points VCC/2
Output Waveform
VCC/2
Test points
VCC/2
Output Load 1TTL + 50 pF [ PD448012-C70X, PD448012-C85X, PD448012-C10X, PD448012-C12X ] Input Waveform (Rise and Fall Time 5 ns)
0.9 VCC VCC/2 0.1 VCC Test points VCC/2
Output Waveform
VCC/2
Test points
VCC/2
Output Load 1TTL + 30 pF
8
Data Sheet M14466EJ5V0DS
PD448012-X
Read Cycle (1/2) (B version)
Parameter
Symbol
VCC 2.7 V
Unit
Condition
PD448012
-B55X MIN. Read cycle time Address access time /CE1 access time CE2 access time /OE to output valid /LB, /UB to output valid Output hold from address change /CE1 to output in low impedance CE2 to output in low impedance /OE to output in low impedance /LB, /UB to output in low impedance /CE1 to output in high impedance CE2 to output in high impedance /OE to output in high impedance /LB, /UB to output in high impedance tRC tAA tCO1 tCO2 tOE tBA tOH tLZ1 tLZ2 tOLZ tBLZ tHZ1 tHZ2 tOHZ tBHZ 10 10 10 0 10 20 20 20 20 55 55 55 55 30 55 MAX.
PD448012
-B70X MIN. 70 70 70 70 35 70 10 10 10 0 10 25 25 25 25 MAX.
PD448012
-B85X MIN. 85 85 85 85 40 85 10 10 10 0 10 30 30 30 30 MAX.
PD448012
-B10X MIN. 100 100 100 100 50 100 10 10 10 0 10 35 35 35 35 MAX. ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns Note 2 Note 1
Notes 1. The output load is 1TTL + 50 pF. 2. The output load is 1TTL + 5 pF.
Read Cycle (2/2) (C version)
Parameter
Symbol
VCC 2.2 V
Unit
Condition
PD448012
-C70X MIN. Read cycle time Address access time /CE1 access time CE2 access time /OE to output valid /LB, /UB to output valid Output hold from address change /CE1 to output in low impedance CE2 to output in low impedance /OE to output in low impedance /LB, /UB to output in low impedance /CE1 to output in high impedance CE2 to output in high impedance /OE to output in high impedance /LB, /UB to output in high impedance tRC tAA tCO1 tCO2 tOE tBA tOH tLZ1 tLZ2 tOLZ tBLZ tHZ1 tHZ2 tOHZ tBHZ 10 10 10 0 10 25 25 25 25 70 70 70 70 35 70 MAX.
PD448012
-C85X MIN. 85 85 85 85 40 85 10 10 10 0 10 30 30 30 30 MAX.
PD448012
-C10X MIN. 100 100 100 100 50 100 10 10 10 0 10 35 35 35 35 MAX.
PD448012
-C12X MIN. 120 120 120 120 60 120 10 10 10 0 10 40 40 40 40 MAX. ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns Note 2 Note 1
Notes 1. The output load is 1TTL + 30 pF. 2. The output load is 1TTL + 5 pF.
Data Sheet M14466EJ5V0DS
9
PD448012-X
Read Cycle Timing Chart
tRC
Address (Input) tAA /CE1 (Input) tCO1 tLZ1 tHZ1 tOH
CE2 (Input)
tCO2 tLZ2 tHZ2
/OE (Input) tOE tOLZ /LB, /UB (Input) tBA tBLZ I/O (Output) High impedance Data out tBHZ tOHZ
Remark
In read cycle, /WE should be fixed to high level.
10
Data Sheet M14466EJ5V0DS
PD448012-X
Write Cycle (1/2) (B version)
Parameter
Symbol
VCC 2.7 V
Unit
Condition
PD448012
-B55X MIN. Write cycle time /CE1 to end of write CE2 to end of write /LB, /UB to end of write Address valid to end of write Address setup time Write pulse width Write recovery time Data valid to end of write Data hold time /WE to output in high impedance Output active from end of write tWC tCW1 tCW2 tBW tAW tAS tWP tWR tDW tDH tWHZ tOW 5 55 50 50 50 50 0 45 0 25 0 20 MAX.
PD448012
-B70X MIN. 70 55 55 55 55 0 50 0 30 0 25 5 MAX.
PD448012
-B85X MIN. 85 70 70 70 70 0 55 0 35 0 30 5 MAX.
PD448012
-B10X MIN. 100 80 80 80 80 0 60 0 40 0 35 5 MAX. ns ns ns ns ns ns ns ns ns ns ns ns Note
Note The output load is 1TTL + 5 pF.
Write Cycle (2/2) (C version)
Parameter
Symbol
VCC 2.2V
Unit
Condition
PD448012
-C70X MIN. Write cycle time /CE1 to end of write CE2 to end of write /LB, /UB to end of write Address valid to end of write Address setup time Write pulse width Write recovery time Data valid to end of write Data hold time /WE to output in high impedance Output active from end of write tWC tCW1 tCW2 tBW tAW tAS tWP tWR tDW tDH tWHZ tOW 5 70 55 55 55 55 0 50 0 30 0 25 MAX.
PD448012
-C85X MIN. 85 70 70 70 70 0 55 0 35 0 30 5 MAX.
PD448012
-C10X MIN. 100 80 80 80 80 0 60 0 40 0 35 5 MAX.
PD448012
-C12X MIN. 120 100 100 100 100 0 85 0 60 0 40 5 MAX. ns ns ns ns ns ns ns ns ns ns ns ns Note
Note The output load is 1TTL + 5 pF.
Data Sheet M14466EJ5V0DS
11
PD448012-X
Write Cycle Timing Chart 1 (/WE Controlled)
tWC Address (Input) tCW1 /CE1 (Input) tCW2 CE2 (Input) tAW tAS /WE (Input) tWP tWR
tBW /LB, /UB (Input) tOW tWHZ I/O (Input / Output) Indefinite data out High impedance tDW Data in tDH High impedance Indefinite data out
Cautions 1. During address transition, at least one of pins /CE1, CE2, /WE should be inactivated. 2. Do not input data to the I/O pins while they are in the output state.
Remarks 1. Write operation is done during the overlap time of a low level /CE1, /WE, /LB and/or /UB, and a high level CE2. 2. If /CE1 changes to low level at the same time or after the change of /WE to low level, or if CE2 changes to high level at the same time or after the change of /WE to low level, the I/O pins will remain high impedance state. 3. When /WE is at low level, the I/O pins are always high impedance. When /WE is at high level, read operation is executed. Therefore /OE should be at high level to make the I/O pins high impedance.
12
Data Sheet M14466EJ5V0DS
PD448012-X
Write Cycle Timing Chart 2 (/CE1 Controlled)
tWC Address (Input)
tAS /CE1 (Input) tCW2 CE2 (Input) tAW tWP /WE (Input)
tCW1
tWR
tBW /LB, /UB (Input) tDW High impedance I/O (Input) Data in tDH High impedance
Cautions 1. During address transition, at least one of pins /CE1, CE2, /WE should be inactivated. 2. Do not input data to the I/O pins while they are in the output state.
Remark
Write operation is done during the overlap time of a low level /CE1, /WE, /LB and/or /UB, and a high level CE2.
Data Sheet M14466EJ5V0DS
13
PD448012-X
Write Cycle Timing Chart 3 (CE2 Controlled)
tWC Address (Input)
tCW1 /CE1 (Input)
tAS CE2 (Input) tAW tWP /WE (Input)
tCW2
tWR
tBW /LB, /UB (Input) tDW High impedance I/O (Input) Data in tDH High impedance
Cautions 1. During address transition, at least one of pins /CE1, CE2, /WE should be inactivated. 2. Do not input data to the I/O pins while they are in the output state.
Remark
Write operation is done during the overlap time of a low level /CE1, /WE, /LB and/or /UB, and a high level CE2.
14
Data Sheet M14466EJ5V0DS
PD448012-X
Write Cycle Timing Chart 4 (/LB, /UB Controlled)
tWC Address (Input)
tCW1 /CE1 (Input) tCW2 CE2 (Input) tAW tWP /WE (Input) tWR
tAS /LB, /UB (Input)
tBW
tDW High impedance I/O (Input) Data in
tDH High impedance
Cautions 1. During address transition, at least one of pins /CE1, CE2, /WE should be inactivated. 2. Do not input data to the I/O pins while they are in the output state.
Remark
Write operation is done during the overlap time of a low level /CE1, /WE, /LB and/or /UB, and a high level CE2.
Data Sheet M14466EJ5V0DS
15
PD448012-X
Low VCC Data Retention Characteristics (TA = -25 to +85C)
Parameter Symbol Test Condition VCC 2.7 V VCC 2.2 V Unit
PD448012
-BxxX MIN. Data retention supply voltage VCCDR1 /CE1 VCC - 0.2 V, CE2 VCC - 0.2 V VCCDR2 CE2 0.2 V VCCDR3 /LB = /UB VCC - 0.2 V, /CE1 0.2 V, CE2 VCC - 0.2 V Data retention supply current ICCDR2 ICCDR3 ICCDR1 VCC = 1.5 V, /CE1 VCC - 0.2 V, CE2 VCC - 0.2 V VCC = 1.5 V, CE2 0.2 V VCC = 1.5 V, /LB = /UB VCC - 0.2 V, /CE1 0.2 V, CE2 VCC - 0.2 V Chip deselection to data retention mode Operation recovery time tR tRC
Note
PD448012
-CxxX
TYP.
MAX. 3.6 3.6 3.6
MIN. 1.0 1.0 1.0
TYP.
MAX. 3.6 3.6 3.6 V
1.0 1.0 1.0
0.5
6.0
0.5
6.0
A
0.5 0.5
6.0 6.0
0.5 0.5
6.0 6.0
tCDR
0
0
ns
tRC
Note
ns
Note tRC : Read cycle time
16
Data Sheet M14466EJ5V0DS
PD448012-X
Data Retention Timing Chart
(1) /CE1 Controlled
tCDR VCC VCC (MIN.)
Note
Data retention mode
tR
/CE1 VIH (MIN.) VCCDR (MIN.) /CE1 VCC - 0.2 V
VIL (MAX.)
GND
Note B version : 2.7 V, C version : 2.2 V On the data retention mode by controlling /CE1, the input level of CE2 must be VCC - 0.2 V or 0.2 V. The other pins (Address, I/O, /WE, /OE, /LB, /UB) can be in high impedance state.
Remark
(2) CE2 Controlled
tCDR VCC VCC (MIN.)
Note
Data retention mode
tR
VIH (MIN.) VCCDR (MIN.) CE2
VIL (MAX.) CE2 0.2 V GND
Note B version : 2.7 V, C version : 2.2 V
Remark
On the data retention mode by controlling CE2, the other pins (/CE1, Address, I/O, /WE, /OE, /LB, /UB) can be in high impedance state.
Data Sheet M14466EJ5V0DS
17
PD448012-X
(3) /LB, /UB Controlled
tCDR VCC VCC (MIN.)
Note
Data retention mode
tR
/LB, /UB VIH (MIN.) VCCDR (MIN.) /LB, /UB VCC - 0.2 V
VIL (MAX.)
GND
Note B version : 2.7 V, C version : 2.2 V
Remark
On the data retention mode by controlling /LB and /UB, the input level of /CE1 and CE2 must be VCC - 0.2 V or 0.2 V. The other pins (Address, I/O, /WE, /OE) can be in high impedance state.
18
Data Sheet M14466EJ5V0DS
PD448012-X
Package Drawing
48-PIN PLASTIC TSOP(I) (12x18)
1 48 F G R detail of lead end
Q 24 25 E P I J A
L S
S D K N S
C MM
B
NOTES
1. Each lead centerline is located within 0.10 mm of its true position (T.P.) at maximum material condition. 2. "A" excludes mold flash. (Includes mold flash : 12.4 mm MAX.)
ITEM A B C D E F G I J K L M N P Q R S
MILLIMETERS 12.00.1 0.45 MAX. 0.5 (T.P.) 0.220.05 0.10.05 1.2 MAX. 1.00.05 16.40.1 0.80.2 0.1450.05 0.5 0.10 0.10 18.00.2 3 +5 -3 0.25 0.600.15 S48GY-50-MJH1-1
Data Sheet M14466EJ5V0DS
19
PD448012-X
Recommended Soldering Conditions
Please consult with our sales offices for soldering conditions of the PD448012-X.
Types of Surface Mount Device
PD448012GY-BxxX-MJH : 48-pin PLASTIC TSOP (I) (12x18) (Normal bent) PD448012GY-CxxX-MJH : 48-pin PLASTIC TSOP (I) (12x18) (Normal bent)
20
Data Sheet M14466EJ5V0DS
PD448012-X
[ MEMO ]
Data Sheet M14466EJ5V0DS
21
PD448012-X
[ MEMO ]
22
Data Sheet M14466EJ5V0DS
PD448012-X
NOTES FOR CMOS DEVICES
1 PRECAUTION AGAINST ESD FOR SEMICONDUCTORS Note: Strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and ultimately degrade the device operation. Steps must be taken to stop generation of static electricity as much as possible, and quickly dissipate it once, when it has occurred. Environmental control must be adequate. When it is dry, humidifier should be used. It is recommended to avoid using insulators that easily build static electricity. Semiconductor devices must be stored and transported in an anti-static container, static shielding bag or conductive material. All test and measurement tools including work bench and floor should be grounded. The operator should be grounded using wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions need to be taken for PW boards with semiconductor devices on it. 2 HANDLING OF UNUSED INPUT PINS FOR CMOS Note: No connection for CMOS device inputs can be cause of malfunction. If no connection is provided to the input pins, it is possible that an internal input level may be generated due to noise, etc., hence causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels of CMOS devices must be fixed high or low by using a pull-up or pull-down circuitry. Each unused pin should be connected to VDD or GND with a resistor, if it is considered to have a possibility of being an output pin. All handling related to the unused pins must be judged device by device and related specifications governing the devices. 3 STATUS BEFORE INITIALIZATION OF MOS DEVICES Note: Power-on does not necessarily define initial status of MOS device. Production process of MOS does not define the initial operation status of the device. Immediately after the power source is turned ON, the devices with reset function have not yet been initialized. Hence, power-on does not guarantee out-pin levels, I/O settings or contents of registers. Device is not initialized until the reset signal is received. Reset operation must be executed immediately after power-on for devices having reset function.
Data Sheet M14466EJ5V0DS
23
PD448012-X
* The information in this document is current as of July, 2001. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. * No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document. * NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC semiconductor products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC or others. * Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. * While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. * NEC semiconductor products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. The recommended applications of a semiconductor product depend on its quality grade, as indicated below. Customers must check the quality grade of each semiconductor product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness to support a given application. (Note) (1) "NEC" as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries. (2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for NEC (as defined above).
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